|Name||Mr. Faheem Muhammed|
|Organization||Florida A&M University|
Additive Manufacturing of low-k Dielectric Materials
Faheem Muhammed1 ,Subramanian Ramakrishnan1, Parth Vakil2 ,Geoffry Strouse2,Larry Holmes3
1 Department of Chemical Engineering, Florida A&M University, Tallahassee FL, 32301
The ability to tune the electromagnetic interference (EMI) shielding efficiency of polymer composites has drawn interest in recent years. The development and miniaturization of electronics increases the need for high-density, high-speed, and high-frequency microelectronic packaging. 3-D additive manufacturing of nanocomposite materials could accomplish packaging benchmarks through filler manipulation, topological optimization, computer aided structural design, and rapid prototyping. Magnetic nanoparticles have been shown to enhance EMI insulation by converting AC fields to thermal energy, at certain frequencies, and by reflection due to the free electrons in their valence shell. The inclusion of sufficiently small particles (<80 nm) further enhances this effect due to a larger surface-to-volume ratio, single magnetic domain, minimal magnetic hysteresis, and a greater impact on the dielectric/magnetic loss in comparison to bulk material. Polymer matrices (polystyrene, poly lactic acid, and acrylonitrile butadiene styrene) were chosen based upon their processibility and high dielectric breakdown voltage. The efficacy of the nanocomposite systems will be determined through magnetic/dielectric spectroscopy and mechanical testing.